In the new era of AI infrastructure, CMOS scaling remains the workhorse for heavy computational workloads. But the need for an energy-efficient solution imposes a paradigm shift at the interconnect level, requiring an intimate 3D co-integration of advanced ASICs and optical connectivity. 

As the architectural complexity of new products increases, relying on state-of-the-art platforms, with a short path to manufacturing. In this workshop, we will highlight how you can access following technologies for your future products:  

• Advanced-node ASIC down to TSMC N2 
• Imec’s integrated photonics platforms from 200G up to co-packaged optics 
• Imec’s advanced 3D packaging technique from interposer to hybrid bonding 

Location: Room 207

Duration: 1 hour

In this session, we will explore the end-to-end workflow of managing foundation model (FM) development on Amazon SageMaker HyperPod. Our discussion will cover both distributed model training and inference using frameworks like PyTorch and KubeRay. Additionally, we will dive into operational aspects, including system observability and resiliency features for scale and cost-performance using Amazon EKS on SageMaker HyperPod. By the end of this hands-on session, you will gain a robust understanding of training and deploying FMs efficiently on AWS. You will learn to leverage cutting-edge techniques and tools to ensure high performance, reliable, and scalable FM development.

Location: Room 206

Duration: 1 hour